This database is a comprehensive data file tracking over 475 total back-end facilities of IDMs and outsourced semiconductor assembly and testing manufacturers. This database offers access to and insights into global OSAT facilities in China, Taiwan, Korea, Japan, Southeast Asia, Europe, and the Americas. The report also highlights packaging technology offerings by manufacturing location. Details include:

• Plant Site technology capability: Tape and Reel, Test
• Packaging assembly service offered: BGA, specific leadframe type such as QFP, QFN, SO, flip-chip bumping, WLP, Modules/SIP, etc. 

**Multi-user and Enterprise licenses must be purchased when more than 1 user accesses SEMI reports/databases**

Key Highlights

Tracking advances in packaging technology, which directly affects chip performance, reliability, and cost, requires the understanding of company offerings by location. Key features of the updated report include:

• 2021 edition includes over 100 new facility additions compared to 2019 report
• The world's Top 20 OSAT companies in 2019 and 2020
• More than 200 companies and more than 475 total back-end facilities 
• Over 325 facilities with Test capabilities
• Over 100 facilities offering leadframe CSP
• Over 80 bumping facilities, including over 50 with 300mm wafer bumping capacity
• More than 90 facilities offering WLCSP technology
• New facilities offering Fan-out wafer-level packaging (FOWLP) and Fan-out panel-level packaging (FOPLP)
• Over 110 OSAT facilities in China, over 100 in Taiwan, over 45 in Americas
• Over 50 IDM A&T facilities in Southeast Asia, around 25 in China, and around 20 in Americas 

Product Information