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The world's largest semiconductor show for 5 years in a row.
With the rapid growing market and government’s new IC initiatives, China’s semiconductor industry is presented with unprecedented growth prospects. It brings opportunities for both China and global players. During SEMICON China 2016 on March 15-17 in Shanghai, global semiconductor industry elites will understand the opportunities and challenges of rapid development of China's semiconductor market, capture business opportunities in the booming industry. |
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| China Memory Strategic Forum |
| Date: Tuesday, March 15, 2016 |
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| Time: 08:30–12:00 |
| Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai |
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Most of the Memory products in China is imported. What will be the business model of China Memory industry, to be independent R&D, leverage on M&A, or to co-work cross the strait? How will it breakthrough the technology and talent barrier? How shall MNC participate in the China Memory industry and share the benefit?
"China Memory Strategic Forum" will enable to share the strategic thinking and open chances for collaboration.
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| SEMI-JEDEC Mobile and IOT Technology Forum |
| Date: Monday, March 14, 2016 |
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| Time: 09:00-17:00 |
| Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai |
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| Ever-increasing expectations for mobile device performance are driving the need for more versatile mobile memory solutions and enhanced mobile infrastructure. The Forum will focus on JEDEC standards, including those for low power DRAMs, and the importance of ultra-low power devices in the mobile and IOT markets. |
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China Memory Strategic Forum Agenda
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| *Agenda is subject to change |
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SEMI-JEDEC Mobile and IOT Technology Forum Agenda
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| Program Moderator: Xianmin Xi - JEDEC |
09:00-09:20
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Registration |
09:20-09:25
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Welcome Remarks
Allen Lu, Ph.D
President, SEMI China |
09:25-09:30
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Welcome Remarks
Mian Quddus
Chairman, JEDEC Board of Directors |
09:30-10:00
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Embracing the Next Wave: froMovingm Convergence to Divergence
Min Jeung Cho,
Principal Engineer, Samsung |
10:00-10:30
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Advanced Package Solutions & Its Challenges for Mobile and IoT/Wearable Devices
Albert Lan
Senior Director, SPIL |
10:30-11:00
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Mobile Market Low-Power Trends From Smartphone to Health,
Wearable, IoT, and Automotive
Hung Vuong
Director of Standard Lead, Qualcomm |
11:00-11:30
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New Era 3D-Interconnection in SiP Technology
CP Hung
Vice President, Corporate R&D, ASE Group |
11:30-12:00
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Mobile & IOT Market Trends and Memory Requirement
Mikeson Wang
ARM |
12:00-13:00 |
Break |
13:00-13:30
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Introducing the Next Generation of Mobile Storage: eUFS and the UFS Card
HeeChang Cho
SW Architect/Principal Engineer, Samsung |
13:30-14:00
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Low Power DRAM Evolution
Dean Gans
Mobile Systems Architect, Micron |
14:00-14:15
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Low Power and High Bandwidth Memory Trend
Sungmin(Sam) Park
Director, SK Hynix
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14:15-14:30
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3D NAND in Mobile
Sang Don Lee
Senior Manager, SK Hynix |
14:30-15:00
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Caching Mechanisms for Mobile and IOT Devices
Masafumi Takahashi
Senior Manager of Memory System Development Dep, Toshiba |
15:00-15:30
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Assuring Customer Satisfaction and Competitive Advantage with the UFS Logo
Perry Keller
Digital Applications and Standards Program Lead, Keysight |
15:30-16:00
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Get it right the first time! How to test for compliance to the LPDDR4 JEDEC Standard.
Barbara Aichinger
Vice President, Future Plus Systems |
16:00-16:30
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Architectural Options for LPDDR4 Implementation in Your Next Chip Design
Marc Greenberg
Director of Product Marketing for DDR Controller IP, Synopsys |
16:30-17:00
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Present and future packaging solutions for the Mobile/IoT Industry
Andrew Peng
Chief Strategy Officer, Vice President of North American & European Business Development, Nantong Fujitsu Microelectronics |
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| *Agenda is subject to change |
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| Conferences and events |
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SEMI is headquartered at 3081 Zanker Road, San Jose, CA 95134, Tel: 1.408.943.6900, Fax: 1.408.428.9600, Web site: www.semi.org |
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