|
Pudong Shangri-La Hotel 上海浦东香格里拉大酒店 2023.10.24 |
|
 |
|
| 日程安排| Agenda: | |
| 08:00 - 09:00 | Registration 注册 |
| Opening remark 开幕致辞 | |
09:00 - 09:05 |
Jeffrey Wang, EVP, NSIG 王庆宇, 执行副总裁, 硅产业集团 |
09:05 - 09:10 |
Yuehui Yu, Chairman, NSIG 俞跃辉，董事长，硅产业集团 |
| Keynote Speech 主题演讲 | |
09:10 - 09:30 |
Lung Chu, President, SEMI China; Vice President, SEMI 居龙, SEMI全球副总裁,中国区总裁 |
09:30 - 09:50 |
RFSOI for the RF Front-End: Then, Now and Tomorrow RFSOI射频前端应用的过去、现在和未来 Julio Costa, Vice President, RF Technology, GlobalFoundries 射频技术副总裁，格罗方德半导体 |
09:50 - 10:10 |
Specialty RFSOI Technology Offering the Diversified Solution of RFFE -- XMC RFSOI Platform (XRTM) Introduction RFSOI特殊技术提供多样化的射频前端解决方案 --武汉新芯RFSOI平台（XRTM) 介绍 Flora Guo, Marketing Director, XMC 郭晓超, 市场总监, 武汉新芯集成电路制造有限公司 |
| 10:10 - 10:40 | Break 茶歇 |
| Session 1: 5G and RF-SOI Technology 专题一：5G及射频SOI技术 | |
10:40 - 11:00 |
Addressing the Challenges for RF Front-End Module Designs 解决射频前端模块设计的挑战 Feng Ling, CEO, Xpeedic 凌峰,总经理, 芯和半导体科技(上海)股份有限公司 |
11:00 - 11:20 |
The Future of RF SOI Lies in Advanced Characterization 射频SOI未来依赖于先进的表征测试 Mostafa Emam, CEO, Incize |
| 11:20 – 12:20 |
Panel Discussion 圆桌论坛 Moderator: Jeffrey Wang, EVP, NSIG 主持人：王庆宇，执行副总裁，硅产业集团 Lung Chu, President, SEMI China，Vice President, SEMI 居龙, SEMI全球副总裁,中国区总裁 Julio Costa, Vice President, RF Technology, GlobalFoundries 射频技术副总裁,格罗方德半导体 Feng Ling, CEO, Xpeedic 凌峰,总经理, 芯和半导体 Mostafa Emam, CEO, Incize Morin Dehan, Europe Design Center Director, CanaanTek 欧洲设计中心总监, 上海迦美信芯通讯技术有限公司 |
| 12:20 - 14:00 | Lunch 午餐 |
| Session 2: SOI Value Chain SOI产业链 专题二：SOI产业链 | |
14:00 - 14:15 |
Trend of RFSOI Based RF Microchips Used for 5G Smartphones RFSOI射频微芯片在5G智能手机中的应用趋势 Morin Dehan, Europe Design Center Director, CanaanTek 欧洲设计中心总监, 上海迦美信芯通讯技术有限公司 |
14:15 - 14:30 |
Wireless Communication: From 5G-Advanced to 6G 无线通信: 从5G+ 到6G Yangyang Peng, Marketing Director, SmarterMicro 彭洋洋，市场总监, 广州慧智微电子股份有限公司 |
14:30 - 14:45 |
SOI Application in 5G RF Front-End Module and Automotive Analog IC SOI在5G射频前端模块和汽车模拟IC中的应用 Xinzhong Duo, Analog & RF Senior Director, SMEC 多新中, 模拟射频资深总监, 绍兴中芯集成电路制造股份有限公司 |
14:45 - 15:00 |
300mm Wafer Substrate for SOI Application 12寸晶圆衬底在SOI的应用 Mingxian Lin, R&D Vice President, Zing Semiconductor 林明献，研发副总裁，上海新昇半导体科技有限公司 |
| 15:00 - 15:30 | Break 茶歇 |
| Session 3: SOI Ecosystem 专题三：SOI生态圈 | |
15:30 – 15:45 |
Approaches and Thoughts on the R&D of MEMS Products in Silan 士兰微对MEMS产品研发的途径与思考 Minchang Wang, Technical Director, Silan Microelectronics 王敏昌，技术总监，杭州士兰微电子股份有限公司 |
15:45 - 16:00 |
SITRI Fab MEMS/Silicon Photronics on SOI Technology 基于MEMS及硅光应用的SOI技术 Weining Li, Head of 8-inch Line, SITRI 李卫宁，8寸线负责人，上海微技术工业研究院 |
16:00 - 16:15 |
New Opportunities with Advanced SOI Substrates and Devices 先进SOI晶圆及器件的新机遇 Qiang Liu, Research Assistant Professor, SIMIT 刘强，研究助理教授，中国科学院上海微系统与信息技术研究所 |
| 16:15 - 16:30 | Power SOI for Automotive Application 基于车规应用的功率SOI |
| 16:30 - 16:45 | MEMS LIDAR Built on Advanced SOI Substrate 基于MEMS激光雷达应用的先进SOI晶圆 |
| 16:45 – 17:00 | Closing Remarks 闭幕致辞 |
| 18:00 - 19:00 | Reception 晚宴接待 |
| 19:00 – 21:00 | Simgui Night Banquet (by invitation only) 新傲之夜（仅限邀请嘉宾） |
感谢接收此邮件。如您想退订请点击此处。
Click here to unsubscribe from this list only.
To unsubscribe from all SEMI email promotions, please email us at [email protected].
Copyright® 2022 SEMI. All rights reserved.
SEMI China is at 8th floor, 2nd Building, No. 1158, Zhang Dong Road, Shanghai, China, 201203
Tel: +86.21.6027.8500, Fax: +86.21.6027.8511, Web site: china.semi.org.cn