| 日期： | 2023年3月1-2日 |
| Time: | 1st-2nd March, 2023 |
| 地点： | 苏州国际博览中心，A106-107 |
| Venue: | A106-107, Suzhou International Expo Centre, China |
| 主办: Organized by： |
SEMI中国 SEMI China 中国科学院苏州纳米技术与纳米仿生研究所 Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), CAS 印刷电子技术研究中心 Printable Electronics Research Centre(PERC) 江苏集萃中科纳米科技有限公司 苏州纳米科技发展有限公司 Nanopolis Suzhou Co., Ltd. |
Conference Introduction：
FLEX China 2023 is one of the SEMI’s global Flex meeting series, which has been held for 12 consecutive years,. Always focusing on the latest research results and development trends of flexible and printed electronics technology, continuously driving domestic research teams to join the research and development of flexible and printed electronics, and helping enterprises to seek opportunities for the industrialization of flexible and printed electronics.
Main Topics:
Synthesis, production and characterization of organic and inorganic electronic inks/pastes
2.柔性电子与印刷电子制造工艺与设备
Processes, techniques and equipments for flexible and printed electronics
3.薄膜有机、无机晶体管的溶液化加工与印刷制备
Solution-processing and/or printing of organic and inorganic thin filmtransistors
4.薄膜太阳能电池的溶液化加工与印刷制备
Solution-processing and/or printing of organic and inorganic thin film solar cells
5.有机、无机发光器件的印刷制备与应用
Printable organic and inorganic light emitting devices
6.印刷显示（OLED、量子点、电子纸）及其相关技术
PrintedOLED, quantum dots and e-paper display
7.印刷传感器技术及其应用
Fabrication flexible and plastic sensors by printing and their applications
8.印刷柔性、可拉伸、可穿戴电子技术及应用
Printed flexible, stretchable and wearable electronics
9.PCB与RFID天线的印刷制备技术及应用
Green manufacturing of printed circuit (PCB) boards and RFID antennas
10.有机、柔性与印刷电子器件的封装技术
Packaging and encapsulation of flexible OLED/OPV and printed electronic devices
11.结合集成电路芯片的柔性混合电子技术
Flexible hybrid electronics by integrating silicon ICs
12.纳米材料的产业化印刷技术
Industrial scale printing of nanomaterials
Conference Agenda:
| Moderator / 主持人： | |
|
Jesse Zhang 张文达 Group Director, SEMI中国 高级总监，SEMI中国 |
13:30-14:00 |
Overview of 10 years development of printed electronics in China and future prospects 中国印刷电子10年发展回顾与展望 Cui Zheng崔铮 特聘研究员，江苏省集萃产业技术研究院 |
14:00-14:30 |
Real printed electronics applications: past, present, and future 真正的印刷电子应用：过去、现在与未来 Khasha Ghaffarzadeh CEO，TechBlick，Germany |
14:30-15:00 |
Flexible Electronic Skin for Robotics and Interactive Systems 用于机器人与交互系统的柔性电子皮肤 Ravinder Dahiya Professor, Glasgow University, UK 教授，英国格拉斯哥大学 |
| 15:00-15:30 | Tea Break 茶歇 |
15:30-16:00 |
Flexible OLED Displays with Ink-jet Printing Technology 基于喷墨打印技术的柔性OLED显示 Weiran Cao 曹蔚然 Vice Director, TCL CSOT 副总监，TCL华星光电AMOLED技术开发处 |
16:00-16:30 |
Materials and devices of flexible and printed electronics 柔性印刷电子材料与器件 Lai Wenyong 赖文勇 Nanjing University of Posts and Telecommunications 南京邮电大学 |
16:30 -17:00 |
Blue quantum dots: the key battle to unlock the industrialization of quantum bots 蓝光QLED：开启产业化的关键之战 Zhong Haizheng 钟海政 Professor, Beijing Institute of Technology 教授，北京理工大学 |
17:00 -17:30 |
Heterogenous Transistor Integration for Flexible Displays and Sensor Systems 面向柔性显示与传感系统的异质晶体管集成 Xiaojun Guo 郭小军 Professor, Shanghai Jiao Tung University 教授，上海交通大学 |
17:30 -18:00 |
印刷电致变色器件及其应用 苏文明 Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), CAS 中科院苏州纳米所 |
| 18:30-20:30 | Invitation Dinner 大会邀请晚宴 |
08:30-09:00 |
Key technologies and applications of large-area organic/perovskite thin-film solar cells 大面积柔性有机/钙钛矿薄膜光伏电池关键技术与应用 Ma Changqi 马昌期 Researcher, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), CAS 研究员，中科院苏州纳米所 |
09:00-09:30 |
Design of interface materials for printable organic photovoltaics 可印刷有机光伏电池的界面材料设计 Yinhua Zhou 周印华 Professor, Huazhong University of Science and Technology 教授，华中科技大学 |
09:30-10:00 |
高效柔性钙钛矿太阳能电池 Lu Haizhou 卢海洲 Southeast University 东南大学 |
| 10:00-10:30 | Tea Break 茶歇 |
10:30-11:00 |
Flexible sensor systems and health information processing 柔性传感系统与健康信息处理 Chen Wei 陈炜 Professor, Fudan University 教授，上海复旦大学 |
11:00-11:30 |
Intrinsic flexible and stretchable polymer photoelectronic materials and devices 本征柔性可拉伸聚合物光电子材料与器件 Guo Yunlong 郭云龙 Researcher, Institute of Chemistry Chinese Academy of Sciences 研究员，中科院化学所 |
11:30-12:00 |
Flexible sensing materials and wearable sensors 柔性敏感材料与可穿戴传感器 Ranran Wang 王冉冉 Researcher, Shanghai Institute of Ceramics, Chinese Academy of Sciences 研究员，中科院硅酸盐所 |
12:00-12:30 |
Electroactive fibric materials and smart textile structures 电活性纤维材料与智能纺织结构 Jian Fang 方剑 Professor, College of Textile and Clothing Engineering, Soochow University; Director, Key Laboratory of Smart Textile-based flexible devices, Chinese Union of Textile Industry 苏州大学纺织与服装工程学院教授，中国纺织工业联合会纺织行业智能纺织服装柔性器件重点实验室主任 |
| 12:30-13:30 | Lunch 午餐 |
13:30-14:00 |
柔性印刷电子的机遇与应用 Wei Jun 魏军 Assistant Principal, Harbin Institute of Technology, Shenzhen 校长助理，哈尔滨工业大学深圳分校 |
14:00-14:30 |
All printed electronics for smart packaging applications 全印刷电子技术与智能包装应用 Wei Wu 吴伟 Professor, Wuhan University 教授，武汉大学 |
14:30-15:00 |
Advanced technology for flexible hybrid electronics manufacturing and packaging 先进的柔性混合电子制备及封装技术 Simon Hao 郝文堂 Founder and CEO, Yi Xin Technology 创始人兼CEO，溢鑫科创科技有限公司 |
| 15:00-15:30 | Tea Break 茶歇 |
15:30-16:00 |
New Materials and approaches for 2D,3D and 4D printed Electronics 用于2D、3D和4D印刷电子的新材料与新方法 Shlomo Magdassi The Hebrew University of Jerusalem Professor; Director of HUJI Center for Functional and 3D Printing 教授，以色列希伯来大学；主任，HUJI功能和3D打印中心 |
16:00-16:30 |
Introduction to SEMI-FlexTech program Gity Samadi Director, SEMI |
16:30-17:00 |
Road to Industrialization of Printed Electronics 印刷电子产业化之路 Peng Xiao 肖鹏 R&D Director of Suzhou Splendid Technology Ltd. 苏州斯普兰蒂科技股份有限公司研发总监 |
17:00-17:30 |
Preparation of Ag Nano-particle and Discussion of Its Application 纳米银粉的批量制备及其应用探讨 Zhongtian Yang 杨仲田 R&D Director, Shanxi Yitaike Electrical Equipment Co.LTD 研发总监，山西壹泰科电工设备有限公司 |
17:30-18:00 |
Low Temperature Sintered Silver Pastes and Applications in Printed Electronics 低温银浆及其在印刷电子技术中的应用 Gu Weibing 顾唯兵 General Manager of Suzhou InnoPrint Electronics Ltd. 苏州创印电子科技有限公司总经理 |
Register：
Sponsor and Register Contact:
| 李亚邦 | 肖凌 / Eileen Xiao |
| Tel: 15862432816 | Tel: 021-6027-8525 |
| Email: [email protected] | Email: [email protected] |
Fee:
| | 一般参会者 General Participant RMB |
学生 Student RMB |
| 常规价- 2月28日前 Regular – Before February 28, 2023 |
2600 | 1400 |
| 现场价- 3月1-2日 On-Site- 1st-2nd March |
3000 | 1800 |
The conference registration fee includes: lunch and tea breaks during the conference, conference materials, and souvenirs.
Dinner and accommodation at your own expense.
感谢接收此邮件。如您想退订请点击此处。
Click here to unsubscribe from this list only.
To unsubscribe from all SEMI email promotions, please email us at [email protected].
Copyright® 2023 SEMI. All rights reserved.
SEMI China is at 8th floor, 2nd Building, No. 1158, Zhang Dong Road, Shanghai, China, 201203
Tel: +86.21.6027.8500, Fax: +86.21.6027.8511, Web site: china.semi.org.cn