| SEMI China 2018年设备材料委员会上半年会议 | |
| SEMI China 20181H Equipment& Material Committee Meeting | |
| 时间: | 2018年6月7日 |
| Time: | Jun 07, 2018 |
| 地点： | 北京经济技术开发区文昌大道8号 |
| Conference room: | No.8 Wenchang Avenue Beijing Economic-Technological Development Area. |
| 协议酒店： | 丰大国际大酒店 |
| Hotel: | Fengda International Hotel Beijing |
| 主办单位： | SEMI | 承办单位： | 北方华创 |
| Organizer： | SEMI | Hoster： | NAURA |
| 09:00-09:30 | 注册合影 Registration / Check-in, Group photo |
| 09:30-09:40 | 承办方欢迎致辞 Host Greetings |
| 09:40-10:00 | 开幕词 Opening Remarks 居龙，SEMI中国区总裁 Lung, SEMI China president |
| 10:00-10:25 | 紫光集团介绍 – 芯云战略 刘红雨，SVP，紫光集团 Hongyu Liu-Luerssen, SVP, Uni-group |
| 10:25-10:55 | 茶歇 Tea Break |
| 10:40-11:05 | 中道先进封装提升设备需求 Meeting Tool Demands from Mideng Packagning Technologies 刘宏钧，副总裁，晶方科技 Russell Liu, VP, WLCSP |
| 11:05-11:30 | 保留 Reserve |
| 11:30-12:30 | 委员会主题讨论 Committee regulations discussion 如何应对飞速发展中的中国半导体产业人才缺口 How to cope talent gap with the rapid development of China's semiconductor industry |
| 12:30-13:30 | 工作午餐 Team Lunch |
| 13:30-15:00 | 北方华创参观 NAURA Tour |
| 15:00-15:30 | 活动总结及结束 Wrap-up and closure |
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