Day1 - Mar.15th, 2018 |
08:30-09:15AM |
Registration / 注册 |
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09:20-09:30AM |
Welcome Remark / 欢迎致辞 Lung Chu 居龙 President, SEMI China SEMI中国,总裁 |
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Opening Keynote Speech / 开幕主旨演讲 |
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Moderator / 主持人:
Naiqian Zhang 张乃千 President of Dynax Semicondutor, Inc. 苏州能讯高能半导体有限公司,总裁 |
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09:30-10:00AM |
GaN Transistors – Giving New Life to Moore's Law 氮化镓晶体管-赋予摩尔定律新生 Alex Lidow CEO of EPC (Efficient Power Conversion) 美国宜普电源转换公司,首席执行官 |
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10:00-10:30AM |
Advances in Power Supply Efficiency and Density Through GaN Integration 大幅提高功率电子效率及密度GaN的新技术 Dan Kinzer CTO, Navitas Semiconductor 纳微半导体,首席技术官 |
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10:30-11:00AM |
Compound Semiconductors - Unleashing the Power 大放异彩的化合物半导体 Drew Nelson CEO, IQE IQE,首席执行官 |
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11:00-11:30AM |
Micro LED : Real Revolution for Display Industry Micro LED :终极显示技术 Charles li 李允立 CEO, Playnitride 錼创科技,首席执行官 |
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11:30-13:30 |
Break / 休息 |
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*Session: Optoelectronics / 光电 |
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Moderator / 主持人:
Aris Ma 马铁中
CEO, AK Optics Technology Co. Ltd 昂坤科技,首席执行官 |
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13:30-14:00 |
GaN-Based VCSEL; Its Latest Progress and Potential Applications 氮化镓VCSEL的最新进展及其潜在应用 Tatsushi Hamaguchi Researching Team Leader, Sony corporation 索尼公司,研发带头人 |
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14:00-14:25 |
The Current Situation and Future Development of the Patterned Sapphire Substrate (PSS) for LED LED用图形化蓝宝石衬底的现状与未来 Kai Kang 康凯
CEO, SINOPATT Technology 中图科技,总经理 |
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14:25-14:50 |
Laser Diodes Deliver Next Generation 3D Sensing Capabilities 激光二极管提供下一代3D感测功能 Dr. Andre Wong
Senior Director, Product Line Management, Lumentum 美国Lumentum公司,产品线管理高级总监 |
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14:50-15:15 |
The Application of High Density ICP Etch Equipment in Compound Semiconductor Devices Manufacture 高密度ICP Etch 设备在化合物半导体器件制造中的应用
Yang Meng 杨盟 Product Director and Deputy GM of Etch Product Division, Etch Product Division, Beijing NAURA Microelectronics Equipment Co., Ltd. 北京北方华创微电子装备有限公司,刻蚀事业部副总经理 |
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15:15-15:30 |
Tea Break / 茶歇 |
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*Session: Compound Semiconductor in 5G Communications / 化合物半导体与5G通讯 |
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Moderator / 主持人:
Brian Lee 李宗鴻 Chief Strategy Officer, WIN Semicondutors Corporation 穩懋半導體股份有限公司,策略長 |
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15:30-15:55 |
GaN Device for 5G Communication Era 5G通讯时代的氮化镓器件 Yi Pei 裴轶 Director of Device Technology, Dynax Semiconductor 能讯高能半导体,器件技术总监 |
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15:55-16:20 |
GaN on Si: Primed for RF Power 硅基氮化镓:为射频功率做好准备 Dr. Markus Behet Chief Marketing Officer, EpiGaN 比利时 EpiGaN公司,首席市场官 |
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16:20-16:45 |
Compound Semiconductor Applications to Future 5G Cell Phone and Power Management Systems 化合物半導體對於未來五G手機及電源管理系統的應用 Barry Lin 林嘉孚 CTO, WAVETEK 聯穎光電股份有限公司,首席技术官 |
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16:45-17:10 |
Third Generation of Semiconductors Device for Power and RF Application 第三代半导体器件的功率与射频应用 Wu Jia 仵嘉 Director, HUAWEI 华为技术有限公司,总监 |
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Day2 - Mar.16, 2018 |
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Moderator / 主持人:
David Xiao 肖国伟 CEO of APT Electronics 广东晶科电子股份有限公司,CEO |
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*Session: Wide Band Gap Power Electronics / 宽禁带功率电子 |
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09:00-09:30AM |
Current Status and Prospect of GaN-on-Si Power Devices and its Applications 硅基GaN功率电子器件的开发与应用的现状及展望 Shunfeng Li 李顺峰 Vice President, Sinopower Semiconductor, Inc. 江苏华功半导体有限公司,副总裁 |
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09:30-10:00AM |
GaN and SiC Semiconductor Production Technologies for Efficient Power Electronics 高效电力电子的GaN和SiC半导体生产技术 Frank Wischmeyer
Vice President Marketing and Business Development Power Electronics, AIXTRON SE |
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10:00-10:30AM |
CMOS Compatible GaN HEMTs on 200mm Wafers CMOS在200毫米 GaN HEMTs器件上的运用 Steve Lester Chief Technical Scientist, ExaGaN 法国 ExaGaN公司,首席科学家 |
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10:30-11:00AM |
GaN-on-Si for RF and Power Electronics: from Lab to Fab 从实验室向产线进阶的硅基氮化镓射频与电力电子
Wang Ronghua 王荣华 Vice President of Technology, Xinguan Technology 大连芯冠科技有限公司,技术副总 |
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11:00-11:30AM |
Innovative SiC MOSFET of Hestia Power and its Applications 新型碳化硅MOSFET產品與其應用介紹 Chwan-Ying Lee CEO, Hestia-Power |
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11:30-13:30 |
Break / 休息 |
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*Session: Emerging Power Device Technology / 新型功率器件 |
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Moderator / 主持人:
Bruce Lee 李博 President of Jiangsu Sinopower Semiconductor Co., LTD 江苏华功半导体有限公司,总裁 |
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13:30-14:00 |
Advances in Silicon Power Semiconductor Device Technology 硅功率半导体器件技术的发展 Madhur Bobde Vice President, Device Technology, AOS 万国半导体,副总裁 |
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14:00-14:30 |
Device and Packaging Technology for Higher Power and Higher Reliability Application 针对大功率和可靠性应用的器件和封装技术 Makan Chen 陈马看 Senior Technical Sales Manager, ABB Switzerland Ltd ABB瑞士,高级技术销售经理 |
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14:30-15:00 |
The Adavantages of 3-in-1 Induction Motor with SiC Inverter Technology 三合一感应电机和碳化硅电控之优势 Jeremo Cao 曹祐铭 CEO of RevoDeve Power Train 大革动力系统,首席执行官 |
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15:00-15:30 |
A Standardized Foundry Process for Silicon Photonics and Future Integration 一个标准化的硅光子学和未来集成的铸造工艺 Dasheng Fang FAE & Sales Manager, Towerjazz |
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15:30-16:00 |
SiC Power Device Technology and Application in Electrified Railway
SiC 功率器件技术及其在电气化轨道交通中的应用 Guoyou Liu 刘国友
Vice Chief Engineer, CRRC Zhuzhou Semiconductor 株洲中车时代电气股份有限公司,副总工程师 |
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16:00-16:40 |
Closing Keynote / 闭幕演讲 Advanced Power Modules for Power Electronics in Electrified Automotive 电气化汽车电力电子的先进功率模块 Gourab Majumdar Senior Fellow of Mitsubishi Electric Corporation, Japan 日本三菱电机,Senior Fellow |
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16:40-17:00 |
Lucky Draw / 幸运抽奖 |