CSTIC 2014

If you cannot view this email page, please click here.

China Semiconductor Technology International Conference
Register Now

China’s Premier Semiconductor Technology Conference
Date: March 16-17, 2014 Venue: SHICC

Welcome to CSTIC 2014, one of the largest and the most comprehensive annual semiconductor technology conferences in China.

-	Close to 500 technical paper submissions, 20% growth over CSTIC 2013
-	350 presentations, 150 keynote and invited talk from leading experts worldwide


Distinguished Conference Keynote Speakers

Tzu-Yin Chiu	Dr. Tak H. Ning	Dr. Kevin Zhang
CEO and Executive	IBM Fellow and Member	Intel Fellow，Vice
Director,SMIC	of US National Academy	President in the
	of Engineering, IBM T.J.	Technology and
	Watson Research Center	Manufacturing Group;
		Intel Corporation

Co-located Training Courses Register Now

Training Course	Early Bird (Before Mar.1, 2014)
Short Course of MEMS Design and Manufacturing	RMB 1200
Short Course of Memory Design and Manufacturing	RMB 1200
TSV Manufacturing Solution Workshop by Applied Materials	RMB 1200

TSV Manufacturing Solution Workshop by Applied Materials

Date: Wed, Mar 17, 2014 Time: 13:30~17:00 Venue: SHICC

Price: Before 1/3, 2014 RMB 1200 After 1/3, 2014 RMB 1500

Attendee Registration: Email to [email protected]

Speakers:

Sesh Ramaswami: Managing director, TSV and Advanced Packaging, Applied Materials

Sesh Ramaswami: Sr. technology director, Semiconductor System Group, Applied Materials China

Loke Yuen Wong: Global Product Manager, Dielectric Systems and Modules, Applied Materials

	Short Course of MEMS Design and Manufacturing Register Now
Date: Wed, Mar 19, 2014 Time: 8:00~12:00 Venue: Kerry Hotel Pudong
Speakers: May Wang: Director of Technology in QST Corporation

	Short Course of Memory Design and Manufacturing Register Now
Date: Wed, Mar 19, 2014 Time: 13:00~18:00 Venue: Kerry Hotel Pudong
Speakers: Dr. Guangyu Sun: Assistant professor of Center for Energy-efficient Computing and Applications (CECA) at Peking University

Co-located Technology Forums Register Now

Technology Forum	Early Bird (Before Mar.1, 2014)
“More than Moore” Technology Forum Enabling technology driving the next wave of semiconductor industry evolution	RMB 600
China Equipment Market Forum China semiconductor equipment market demands, challenge and trend	RMB 600
IC Application from Design to Manufacturing Forum Seek driving force of IC design and Manufacturing innovation	RMB 600
Advanced Packaging Technology Forum Discover core technology to support advanced packaging	RMB 600


	“More than Moore” Technology Forum Register Now

Internet-of-Things Application driven MtM innovation

Date: Wed, Mar 19, 2014 Time: 8:00~12:00 Venue: Kerry Hotel Pudong

Speakers:


Shaobin Zhu	Albert Ou	Leopold Beer	Dr. Sheng'an Xiao
Attorney-at-Law, Finnegan Henderson, Farabow, Garrett & Dunner, LLP	Director, Corporate R&D, ASE Group	Regional President Asia Pacific, Bosch	Senior Director of Advanced Modules, HHGrace


Dani Ashkenazi	Javen Tan	Qixing Liu
Vice President of Sales for APAC & Israel, TowerJazz	Director, APAC and Japan, Altis Semiconductor	Director, ASMC

	China Equipment Market Forum Register Now
China semiconductor equipment market demands, challenge and trend
Date: Wed, Mar 19, 2014 Time: 13:00~17:30 Venue: Kerry Hotel Pudong

Speakers:


Guoming Zhang	Roger TH Chang	Shaohua Liu	Jonathan Shang
Vice President, Beijing Sevenstar Electronics Co., LTD Co-Chair, SEMI China semiconductor equipment committee	General Manager，China / OSAT Account, SSG，Applied Materials Country President, Applied Materials China	Vice president, Beijing NMC Co.,Ltd	General Manager, SurplusGLOBAL China Inc


Michael Chu	Richard Qian	Qingyu Yin
Vice president, Advanced Micro-Fabrication Equipment Inc.	Sales director, Tokyo Electron (Shanghai) Limited	Partner, Finnegan, Henderson, Farabow, Garrett & Dunner,LLP

	IC Application from Design to Manufacturing Forum Register Now
Smart Life enabled by Semiconductor Technology
Date: Thu, Mar 20, 2014 Time: 8:00~12:00 Venue: Kerry Hotel Pudong

Speakers:


Ningling Wang	Timothy Lau	Subramani Kengeri	Dr. David Shih
Managing partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP	Director of Automotive Networking, Broadcom	Vice President, Advanced Technology Architecture, Office of the CTO, GLOBAL FOUNDRIES	Director, Product Marketing, SMIC


Peter Chen	Dr. Kwei-Kuan KUO	Dr. Ouyang Xu
Director, China Business Development, TSMC.	Director, R&D of Suzhou ASEN, ASE Group	CEO, Semitronix

	Advanced Packaging Technology Forum Register Now
Mobile and Wearable Device, new frontier of Advanced Packaging
Date: Thu, Mar 20, 2014 Time: 13:00~18:00 Venue: Kerry Hotel Pudong

Speakers:


Dr. Yifan Guo	Rolf Aschenbrenner	Fumio Ohyama	Chang-Yi (Albert) Lan
Vice President of Engineering, ASE Shanghai	IEEE Fellow / Deputy Director, Fraunhofer IZM,	Deputy Chief Sales Officer, Tera Probe	Senior Director, SPIL


Dr. Ed Chang	Dr. Zhenqiu Liu	Gregory Smith	Peijun Ding
Director, China Business Development, TSMC.	Director of Wet Process Engineering, TEL, USA	General Manager, Computing & Communications Business Unit Teradyne	Vice president, Beijing NMC Co.,Ltd.

Good gifts for pre-register

Co-located with

Co-located Events

Pre-SEMICON marketing promotion

Contact us

Kevin Wu
+86.21.6027.8558
[email protected]

JY Zhang
+86.21.6027.8556
[email protected]

Norman Cheng
+86.21.6027.8557
[email protected]

感谢接收此邮件。如您想退订请点击此处。
Click here to unsubscribe from this list only.
To unsubscribe from all SEMI email promotions, please email us at [email protected].

Copyright® 2013 SEMI. All rights reserved.

SEMI is headquartered at 3081 Zanker Road, San Jose, CA 95134, Tel: 1.408.943.6900, Fax: 1.408.428.9600, Web site: www.semi.org