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中国国际半导体技术大会
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| 2010年3月18－19日 |
| 上海兴荣豪廷大酒店（浦东大道2288号） |
大会日程先睹为快！2010年1月30日前报名将享受25%的折扣! |
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中国国际半导体技术大会（CSTIC）是世界水平的半导体技术大会，CSTIC 2010将汇聚近百名全球知名半导体与光伏技术专家同台演讲，9场技术分会共有280篇精彩报告，一场国际水准的技术盛宴期待您的参与！ |
CSTIC 2010 大会主题演讲嘉宾
   
- Dr. Stuart S.P. Parkin, IBM Fellow, IBM, USA
- Dr. Simon Yang, Senior Vice President, Chartered Semiconductor Manufacturing Ltd., Singapore
- Dr. T. P Ma, Director of Yale Center for Microelectronics, Yale University, USA
- Dr. Zhengrong Shi, Chairman & Chief Executive Officer, Suntech Power Co. Ltd, China
Symposium I: Design and Device Engineering
Rich Liu Macronix International, Charge trapping devices for future NAND flash memories
Subramanian S. Iyer IBM, Three Dimensional Integration for Memory Applications
Minhwa Chi SMIC, CMOS Technologies toward Green
Hsing-Huang Tseng Texas State University, High-K/metal gate
Cor Claeys IMEC, Impact of radiation on the operation and reliability of deep submicron CMOS
Symposium II: Metrology, Reliability and Testing
J. V. Martinex de Pinillos National Institutes of Standards and Technology, USA
Yervant Zorian Virage Logic Corp. USA
Xiaoqing Wen Kyushu Institute of Technology, Japan
Benjamin Bunday International Sematech Manufacturing Initiative
Richard J. Matyi National Institute of Standards and Technology, USA
James Stathis IBM T.J. Watson Research Center
Symposium III: Materials and Process Integration for Device and Interconnection
Stefan Lai Being Advanced Memory, Future Trend and Opportunities of Non-Volatile Memory
David B. Graves UC-Berkeley, Pushing the Limits of Plasma Etch to the Nanoscale
Jingang Wu SMIC, Different Interface Role in CuOx Based RRAM
Supratik Guha IBM, Materials Science at the Nanometer Scale in High-k Oxides Technology for Silicon Technology
Symposium IV: Patterning and Lithography
Burn J.Lin TSMC, Making a Decision on a Manufacturing Technology for 32-nm Half-Pitch Nodes
Yan Borodovsky Intel, ComplementaryPatterning-Viability andGaps
Andreas Erdmann Fraunhofer IISB, Mask and Wafer Topography Effects in Optical and EUV-Lithography
Tracy Weed Synopsys, OPC
Banqiu Wu Applied Materials, EUV lithography: coming with many challenges
Yalin Xiong KLA-Tencor, Lithography Simulation in Mask Inspection and Defect Dispositioning
Symposium V: CMP and Post-CMP Cleaning
Duane Boning MIT, CMP Mechanisms and Models: Progress and Challenges
Chris Yu Anji Microelectronics
Feng Chen SMIC, CMP Challenges& Opportunities for Advanced Technology
Lee Cook Dow Electronic Materials, Scaling of Critical Wiring and Implications for Barrier CMP
Yuchun Wang Applied Materials, CMP process technology in TSV application
David Yin ATMI, High Productivity Combinatorial Analysis of Cu Post CMP Cleans
Symposium VI: Thin Film, Etch & Plating
Yue Kuo Texas A&M University, ULSI vs. TFT Technologies - from Nano to Giga Electronics
Roy G. Gordon Harvard University, Vapor Deposition of Materials for Microelectronics
Sven Van Elshocht IMEC, On the process and material sensitivities for high-k based dielectrics
Larry Zhao Intel, A Novel Test Structure for Barrier/Low-k Development
Jon Reid Novellus, Cu Electrodeposition for 22nm Damascene Structures
Tom Ni AMEC
Symposium VII: Packaging and Assembly
John Knickerbocker IBM, System on Package & 3D Integration
Michael Todd Henkel, Materials Roadmap to Support The Packaging Trend
Robert Lo ITRI, Commercialization of 3DIC
William Chen IEEE CPMT, The Critical Role of Packaging in the Overall Semiconductor Value Chain
Symposium VIII: Emerging Semiconductor Technologies
Roy G. Gordon Harvard University, CVD of Self-Aligned Contacts, Barriers, Adhesion and Seed Layers
Chung H. Lam IBM, Phase Change Memory: Opportunities and Challenges
George Bourianoff Intel, Post Si CMOS
Christine Ouyang IBM, Fully Depleted SOI Devices for 15nm and beyond
Symposium IX: Silicon Technology for Electronic and Photovoltaic Applications
Henry F. Erk MEMC, Wet Etching Technology for Semiconductor and Solar Silicon Manufacturing
Wang Xi Shanghai Simgui, Industrial SOI technology by ion implantation
Robert L Rhoades Entrepix, Polishing of Semiconductor Materials
Michel Frei Applied Materials, End-to-end Modeling for Thin-Film Silicon Photovoltaics
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英文（English）
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联系我们：
SEMI 中国办公室
电话：+86.21.5027.0909
传真：+86.21.5027.4830
电邮：[email protected]
CSTIC 大会专员
林崴
电话：+86.21.50270909转257
电邮：[email protected] |
