2018年10月11~12日，SEMI中国联合上海市经信委、金山区政府、第一手机界研究院共同举办2018国际新型显示与智慧互联大会 暨 第二届“金水湖”论坛。论坛将邀请全球半导体显示，移动设备制造与智能汽车领域的产业领袖，齐聚金水湖，探讨新型显示产业在5G大潮中的机遇与挑战，为国内外的产业相关者搭建一个充分交流，广泛合作的国际化平台。
| 主办单位： | 上海市经信委 |
| 金山区政府 | |
| 国际半导体产业协会SEMI | |
| 第一手机届研究院 | |
| Organizers: | Shanghai Municipal Commission of Economy and Information Technology |
| Shanghai Jinshan District Government | |
| SEMI China | |
| Mobile No.1 Research Institute | |
| 支持单位： | 新型显示技术教育部重点实验室、SID、CODA、FLEXTECH、中国OLED产业联盟、上海OLED产业技术创新战略联盟、CINNO、上海通信制造业行业协会、上海光电子行业协会、上海物联网行业协会、上海交通电子行业协会 |
| 13:00 – 18:00 | 签到，领取会议资料 |
| Attendees registration, pick up conference materials | |
| 18:00 – 20:00 | 贵宾欢迎晚宴（仅限受邀） |
| Welcome dinner for VIPs (Invited only) | |
| 10月12日 October 12 | |
| 08:30 – 09:30 | 观众签到 |
| Attendees registration | |
| 09:30 – 09:35 | 司仪宣布启动会开始，介绍各位参会嘉宾 |
| Moderator announces opening and introduces attendees. | |
| 09:35 – 09:40 | 金山区政府领导致欢迎词（胡卫国区长） |
| Welcome speech by Jinshan District Chief Mr. Hu Weiguo | |
| 09:40 – 09:45 | 中国光学光电子行业协会液晶分会常务副理事长 梁新清 致辞 |
| Congratulations/Speech by CODA Executive Vice President Mr. Liang Xinqing | |
| 09:45 – 09:50 | 上海市经信委副主任 傅新华 致辞 |
| Congratulations/Speech by Deputy Director of Ministry of Industry and Information Technology, Shanghai municipal government, Mr. Fu Xinhua | |
| 09:50 – 09:55 | 工信部领导 致辞 |
| Congratulations/Speech by leader of Ministry of Industry and Information Technology of the PRC | |
| 09:55 – 10:05 | 上海市新型显示产业政策解读 上海市经信委电子信息处处长 肖健 |
| Introduction to Shanghai's policy of emerging display industry by Xiaojian | |
| 10:05 – 10:15 | 金山新型显示产业基地发展情况介绍 上海新金山工业投资发展有限公司党委书记、董事长 周永超 |
| 10:15 – 10:30 | 签约及揭牌仪式 |
| Signing/Openning ceremony of key industry projects in Jinshan district | |
| 10:30 – 11:00 | 演讲一： | 题目待定 | 和辉 | 副总裁 首席技术官 |
陈志宏 博士 |
| Speech 1: | Topic TBD | EDO | VP, CTO | Jr-Hong Chen Ph.D | |
| 11:00 – 11:30 | 演讲二： | 题目待定 | 天马 | 天马上海AMOLED产业基地负责人 | 赵奇峰 |
| Speech 2: | Topic TBD | TIANMA | Zhao Qifeng | ||
| 11:30 – 12:00 | 演讲三： | IBM智能制造实践与观察 | IBM | 大中华区工商企业 事业部总经理 |
陈怀宇 |
| Speech 3: | IBM's Practice and Observation on Smart Manufacturing | IBM | GM of Enterprise Division in Greater China | David Chen | |
| 12:00 – 12:30 | 演讲四： | TDDI与OLED驱动IC将成为面板驱动IC行业的下一个引爆点 | CINNO | 副总裁 | 杨文得 |
| Speech 4: | TDDI and OLED Driver IC, The huge opportunity in Driver IC Industry | CINNO | VP | Sean Yang | |
| 12:30 – 13:30 | 自助式午餐 | 企业高层交流午宴（仅限邀请） | |||
| Buffet Lunch | Executives lunch (Invited only) | ||||
| 13:30 – 14:00 | 演讲五： | 5G终端进程时间表 | 紫光展锐 | 副总裁 | 南明凯 |
| Speech 5: | The Roadmap of 5G Terminals | UNISOC | VP | Nan Mingkai | |
| 14:00 – 14:30 | 演讲六： | 打造全新5G生态 | 上海移动 | 网络部副总经理 | 孟忻 |
| Speech 6: | Build the new ecosystem in 5G era | China Mobile | Meng Xin | ||
| 14:30 – 15:00 | 演讲七： | 5G终端跨界商机 | 龙旗 | CEO | 葛振纲 |
| Speech 7: | The Business opportunities among 5G Terminals | Longheer | CEO | Ge Zhengang | |
| 15:30 – 15:30 | 茶歇 | ||||
| Tea Break | |||||
| 15:30 – 16:00 | 演讲八： | 车载显示 | 上汽集团 | ||
| Speech8: | Vehicle Dispaly | SAIC | |||
| 16:00 – 16:30 | 演讲九： | 下一个万亿级市场机遇---新型显示智能家居 | ARM | 全球执行副总裁兼大中华区销售副总裁 | 刘润国 |
| Speech9: | The next trillion RMB Business opportunity----New Display technology in smart home | ARM | VP | Liu Runguo | |
| 16:30 – 17:00 | 演讲十： | 小米 | TBD | ||
| Speech10: | Xiaomi | ||||
| 17:00 – 19:00 | 答谢&交流晚宴 | ||||
| Dinner | |||||
| Contact Person: | Mr. Will Li （李先生） |
| TEL: | 86.21.60278525 |
| Email: | [email protected] |
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