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SEMI中国封测委员会第十三次会议
SEMI China 13th Assembly and Test Committee Meeting
 
时间： 2018年6月6日
Time: Jun 06, 2018
地点： 北京
Conference Room: Beijing
 
主办单位： SEMI 承办单位： 北方华创
Organizer: SEMI Hoster: NAURA
 
议程 / Agenda
 
2018年6月6日 / Jun 06, 2018
 
13:00 – 13:30 报道注册
Registration
   
13:30 – 14:00 委员会主席致辞，梁主任致辞，SMIC致辞，SEMI致辞
Welcome speech by Committee Chairman, Liang Sheng, SMIC and SEMI
   
14:00 – 14:30 先进封装的市场，发展及展望
Market, Development and Prospect for Advanced Packaging
Shiuh-kao Chiang, 董事长，Prismark
Shiuh-kao Chiang, CEO, Prismark
   
14:30 – 15:00 物联网下的芯片机遇
Road map and strategy of NAURA in advanced packaging industry
陈苑锋，芯片规划师，Alibaba
Winfred, Staff Engineer, IoT BU, Alibaba
   
15:00 – 15:15 茶歇，集体照
Tea Break, photo taking
   
15:15 – 15:45 NAURA在先进封装领域的产品拓展与发展策略
NAURA's Roadmap and Development Strategy in Advance Packaging
丁培军，副总裁/PVD事业部总经理，NAURA
Peijun Ding, SVP, GM of PVD BU, NAURA
   
15:45 – 17:00 产业链高端对话
所有参会嘉宾
Dialog: From IC Design to Manufacturing
All attendees
   
18:00 – 20:00 贵宾晚宴
Dinner by invitation only
   
注意事项：同期举办SEMI会员日（6月6日上午）和SEMI设备材料委员会（6月7日上午），了解更多请直接联系SEMI。
 
Note: Know more about the co-located SEMI member day(morning on Jun 6) or SEMI Equipment and Material committee meeting(morning on Jun 7), please contact SEMI directly.
 

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