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活动亮点 High Light
国产设备龙头企业分享供应链管理
  Local equipment tiger sharing supply chain management
封测厂商分享先进封装技术
  Test & Package tiger sharing advanced packaging technology
SEMI 资深分析师分享中国半导体产业发展的机遇和挑战
  SEMI senior analyst sharing the opportunities and challenges of semiconductor in China
大半导体产业链上下游互动
  Industry interaction
 
会议时间和地点 Meeting Time & Venue
时间 Time:9:30am-16:00pm    2018年6月6日    6th June' 2018
地点 Venue:北京亦庄开发区    E-town Beijing
 
会议议程 Meeting Agenda
09:30-09:45 嘉宾登记 Registration
   
09:45-09:50 欢迎致辞 Welcome Speech
居龙 Lung Chu
SEMI 中国,SEMI全球副总裁,SEMI中国区总裁
SEMI China, President of SEMI China, Vice President of SEMI
   
09:50-10:20 TBD
周洋
北方华创,供应链管理,副总
Naura, Vice President, Supply Chain Management
   
10:30-11:00 中国半导体产业发展的机遇与挑战
Opportunities and challenges of China semicondutor industry

杜珊珊 Shanshan Du
SEMI中国,资深分析师
SEMI China, Senior Analyst
   
11:00-11:30 先进封装技术介绍与分享
Introduction of advanced packaging technology

郭一凡 YiFan Guo
日月光集团,副总
ASE Group, Vice President
   
11:30-12:00 开放性讨论
Open Discussion
   
12:00-13:30 午餐
Lunch
   
14:00-15:30 SEMI中国会员和韩国会员交流互动
Members cross-region interaction
   
15:30-16:00 参观北方华创
Factory Tour of Naura
   
 
酒店预订 Hotel Booking
协议酒店 Contract Hotel: 北京丰大国际大酒店 Fengda International Hotel
协议价格 Contract Price: 大床房 Double Room 418RMB/Night
    行政房 Executive Room 508RMB/Night
 
参会报名 Enrollment
SEMI 会员免费参加 Member Free
参会请联系 SEMI Contacts
Louisa Li [email protected] Tel: 86-21-60278566
Chelsea Shao [email protected] Tel: 86-10-68715396
 

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