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SEMI中国封测委员会第十二次会议
 
时间 / Time:2017年12月7 - 8日(Dec 07 to Dec 08, 2017)
地点 / Address:上海(Shanghai)
 
主办单位 / Organizer:国际半导体产业协会(SEMI)
承办单位 / Hoster:安靠(Amkor)
 
会议日程 / Meeting Agenda
 
12月7日 / Dec 7:18:30    欢迎晚宴 / Welcome dinner
 
12月8日 / Dec 8
09:00-09:10 委员会主席致辞,安靠致辞,SEMI致辞
  Welcome speech by Committee Chairman, Amkor and SEMI
09:10-09:40 SEMI封装制程标准的热点James Amano, SEMI 标准部门高级总监
  SEMI Packaging Standard Highlights James Amano, Senior Director, SEMI Standard
09:40-10:10 扇出形封装所需之先进塑封技术早坂昇 ,Towa 执行役员 ,开发本部长
  Molding Technology for Fan-Out Packaging Noboru Hayasaka, Exective Officer, Division Manager of Development Div
10:10-10:20 茶歇 / Tea Break
10:20-10:50 先进封装周晓阳,Amkor中国区总裁
  Advanced Packaging Gilbert Zhou, Amkor China President
10:50-12:00 IC设计制造产业链高端对话
  Dialog: From IC Design to Manufacturing
12:00-13:30 午餐 / Lunch
13:30-14:00 启程前往安靠外高桥工厂
  Transportation to Amkor Factory
14:00-16:00 体育联谊:乒乓球,羽毛球,桌球
  Team Building: Table Tenis, Batminton, Pool
16:00 集体照,会议结束
  Photo Taking, End of the meeting
 
注意事项:本次活动涉及轻度体育活动,请携带球鞋及舒适的服装
Note: Please bring casual / sport wear
 
联系SEMI / Contact SEMI:
张文达 / Jesse Zhang: 021-60278558
张瑾 / Kelly Zhang: 021-60278556
 

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