| 09:00-09:10 | 委员会主席致辞，安靠致辞，SEMI致辞 |
| Welcome speech by Committee Chairman, Amkor and SEMI | |
| 09:10-09:40 | SEMI封装制程标准的热点James Amano, SEMI 标准部门高级总监 |
| SEMI Packaging Standard Highlights James Amano, Senior Director, SEMI Standard | |
| 09:40-10:10 | 扇出形封装所需之先进塑封技术早坂昇 ，Towa 执行役员 ，开发本部长 |
| Molding Technology for Fan-Out Packaging Noboru Hayasaka, Exective Officer, Division Manager of Development Div | |
| 10:10-10:20 | 茶歇 / Tea Break |
| 10:20-10:50 | 先进封装周晓阳，Amkor中国区总裁 |
| Advanced Packaging Gilbert Zhou, Amkor China President | |
| 10:50-12:00 | IC设计制造产业链高端对话 |
| Dialog: From IC Design to Manufacturing | |
| 12:00-13:30 | 午餐 / Lunch |
| 13:30-14:00 | 启程前往安靠外高桥工厂 |
| Transportation to Amkor Factory | |
| 14:00-16:00 | 体育联谊：乒乓球，羽毛球，桌球 |
| Team Building: Table Tenis, Batminton, Pool | |
| 16:00 | 集体照，会议结束 |
| Photo Taking, End of the meeting |
感谢接收此邮件。如您想退订请点击此处。
Click here to unsubscribe from this list only.
To unsubscribe from all SEMI email promotions, please email us at [email protected].
Copyright® 2017 SEMI. All rights reserved.
SEMI China is at 8th floor, 2nd Building, No. 1158, Zhang Dong Road, Shanghai, China, 201203
Tel: +86.21.6027.8500, Fax: +86.21.6027.8511, Web site: www.semichina.org