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SEMI中国柔性电子技术委员会启动会议议程
SEMI China FlexTech Committee Kickoff Meeting Agenda
 
时间:2017年10月27日下午13:00-17:30周五
Date: PM13:00-17:00, Oct. 27 2017, Friday
地点:苏州
Address: Suzhou
 
主办单位:国际半导体产业协会
Organizer: SEMI
 
议程Agenda:
 
13:00 – 13:10 报到
Attendees registration
   
13:10 – 13:20 主持人宣布启动会开始,介绍各位参会嘉宾
Moderator announces opening and introduces attendees.
   
13:20 – 13:40 SEMI中国总裁居龙致欢迎辞
SEMI China President Chu Lung delivers welcome speech
   
13:40 – 14:10 SEMI | FlexTech CTO Melissa Shemansky介绍FlexTech
SEMI | FlexTech CTO Melissa Shemansky introduce FlexTech
   
14:10– 14:40 各位委员做自我介绍 (每人2~3分钟)
Self-introduction of each member (2~3 min each)
   
14:40 – 14:50 集体讨论、并表决通过委员会主席、副主席人选, 及委员会章程
Group discussion and vote for the chairman, vice chairman and committee by-laws
   
14:50 – 15:10 SEMI中国总裁居龙向委员颁发聘书,并合影
SEMI China President Chu Lung issues appointment letters to committee members, and photo.
   
15:10 – 15:30 茶歇
Tea Break
   
15:30 – 15:50 技术演讲1: 柔性显示
王磊 总经理 ,广州新视界光电科技有限公司
Technical Presentation 1 : Flexible Display
Mr. Wang Lei, General Manager, Guangzhou New Vision Opto-Electronic Technology Co.,Ltd
   
15:50 – 16:10 技术演讲2: 基于低维半导体纳米结构的柔性传感器及多功能系统的研究
沈国震 研究员 ,中科院半导体所
Technical Presentation 2 : Flexible sensors and multifunctional systems based on low dimensional semiconductor nanostructures
Prof. Shen Guozhen, Institute of Semiconductors, Chinese Academy of Science
   
16:10 – 16:30 技术演讲3: 柔性封装基板在芯片封装的应用
崔成强 教授,广东工业大学
Technical Presentation 3 : Flexible substrate for applications in IC packaging
Prof. Cui Chengqiang, Guangdong University of Technology
   
16:30 – 16:55 自由讨论,确定委员会今后工作方向,商定下一次委员会会议地点及时间
Free discussion, define the main directions of future committee work, and decide next committee meeting place and date.
   
16:55 – 17:00 SEMI宣布FLEX China 2018举办时间,地点
SEMI Announces FLEX China 2018 location and date.
   
17:00 – 17:30 参观纳米所印刷电子中心
Lab tour in the Printable Electronics Research Center
   
18:30 – 20:30 招待晚宴
Dinner
   
 

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