China Equipment Market to Rise 82% in 2014 -- Access More than US$11 Billion in Buying Power at SEMICON China 2014！

The China semiconductor market continues to generate excitement worldwide and is poised to jump in 2014, with forecasts projecting an 82% increase in equipment sales to more than US$5 billion, and a rise in the materials market to US$6 billion. The combined US$11 billion market cements China's position as one of the world's leading microelectronics manufacturing markets.

SEMICON China 2014 Highlights
- 1,200+ exhibitors
- 3,000+ booths*
- 60,000+ visitors
- 180+ government delegations

*Combined SEMICON, FPD, and SOLARCON exhibits

Access Growing Buying Power in China in Semiconductors, LED, Solar/PV and More

The growth of the China market has brought increased investment and further expansion beyond semiconductors, including LEDs, displays, MEMS, and solar/PV. Each of these markets--and the buyers from China's leading technology companies--are represented at SEMICON, FPD, and SOLARCON China. Combined, these events attract more companies, more buyers, and more key decision-makers than any other industry event in China.

Exhibit space is filling fast--book your exhibit today!

A New Pavilion Powered By SEMI
Smart Life Pavilion - Smart Life powered by semi! Hall N5
To experience "More-than-Moore" in real life? This pavilion will present you with smart Park, smart building, smart home and other smart concepts.
90% Space has Gone in Classic Pavilions!
Seize The Last Opportunity

For 2014, the China PV Technology International Conference (CPTIC) will join CSTIC with the Symposium XII: Si Materials and Photovoltaic Technology.

Dates & Location: March 16-17, 2014 - Shanghai International Conference Center

	JY Zhang +86.21.6027.8556 [email protected]
Symposium I to XI Confirmed Invited speaker
	Kris Shen +86.21.6027.8568 [email protected]
Symposium XII Confirmed Invited speaker

CSTIC 2014 Keynote Invited Speakers		CSTIC 2014 Symposiums
		Symposium I:	Design Engineering and Technology
		Symposium II:	Lithography and Patterning
		Symposium III:	Dry & Wet Etch and Cleaning
		Symposium IV:	Thin Film Technology
		Symposium V:	CMP, Wafer Substrate Polishing and Post-Polish Cleaning
		Symposium VI:	Materials and Process Integration for Device and Interconnection
Dr. Kevin Zhang	Tzu-Yin Chiu	Symposium VII:	Packaging and Assembly
Intel Fellow，Vice	CEO and	Symposium VIII:	Metrology, Reliability and Testing
President,	Executive	Symposium IX:	Emerging Semiconductor Technologies
Technology	Director,	Symposium X:	Advances in MEMS and Sensor Technologies
and Manufacturing	SMIC Ph.D.,	Symposium XI:	Circuit Desin, System Integration and Applications
Group;		Symposium XII:	Si Materials and Photovoltaic Technology