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半导体产业报告
中国半导体封装市场研究报告2017
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出自:SEMI


随着《国家集成电路产业发展推进纲要》的实施和推动,2017年中国集成电路产业已经达到816亿美元的规模,伴随着半导体产业结构的进一步优化,封装产业比重虽然被设计业超过,但依然维持着以较快的年均增长率, 13%的成长率贡献了280亿美元的销售额。截至2017年,全球封装材料市场为198亿美元几乎没有明显增长,但是中国封装市场以全球最高的复合增长率就占据了全球约23%的市场;另外,中国的封装设备市场也占全球封装设备市场的36.8%。

SEMI® 中国近期完成了关于针对中国半导体封装市场的深入研究报告,收集调查了超过130家中国封装厂以及分立器件公司的经营资料,并调查了主要多家封装材料和设备的供应商,以确保此份报告的准确性和前瞻性。



此份报告回答了以下关键问题:

• 全球经济发展的形式下中国半导体封装市场的发展状况;
• 近几年出台了的国家政策对半导体及封装行业有什么导向和影响;
• 中国分立器件与LED封装市场情况;
• 2016-2017年中国封装厂所发生的重大并购事件和建厂状况;
• 2007-2021年全球以及中国封装材料的销售情况以及市场预估;
• 最新中国封装材料和设备供应商的发展情况。

关于本报告更多信息请联络SEMI中国半导体产业资深分析师Shanshan Du ,sdu@semi.org

主要内容


China Semiconductor Packaging Market Outlook

1.   INTRODUCTION
1.1 Methodology
      Table 1.1 Companies Interviewed 
1.2 Assumptions
      Table 1.2 Currency Exchange Rates
1.3 Report Organization

2.   CHINA SEMICONDUCTOR PACKAGING MARKET BACKGROUND
2.1 China Macro-Economy & Electronics Manufacturing
      Table 2.1 China Electronics Market
      Figure 2.1 China GDP & GDP Growth Rates (2000-2017E)
2.2 China Government’s Policy on Semiconductor Industry and Packaging & Testing
      Figure 2.2 Central Government Semiconductor Industry Policies 
      Table 2.2 National Guideline Targets for Semiconductor Industry
      Table 2.3 Major Investments of China National IC Fund 
      Table 2.4 Announced Local Investment IC Funds Summary
2.3 China Semiconductor Industry
      Figure 2.3 China Semiconductor Industry Revenue
      Table 2.5 China Semiconductor Industry Revenue by Segment

3.   CHINA SEMICONDUCTOR PACKAGING INDUSTRY OUTLOOK
3.1 Semiconductor Packaging and Assembly Companies in China
      Figure 3.1 Packaging Companies by Region
      Table 3.1 World Top Ten OSAT Facilities in China
      Table 3.2 World Top Ten IDM Packaging & Test Facilities in China
      Figure 3.2 History of Packaging Company Count by Region and Capacity 
      Figure 3.3 Map of Leading Packaging and Testing Plants in China
      Figure 3.4 China-Based Leading Packaging House Revenue Trends
3.2 Semiconductor Packaging and Assembly Activities in China 2013-2015
3.3 Advanced Packaging (Bumping/WLCSP & TSV) in China
      Table 3.3 Companies with Bumping/WLCSP/TSV Lines in China
      Table 3.4 Domestic Wafer Level Packaging Equipment Suppliers
3.4 Key Domestic Semiconductor Discrete Companies & Packaging Capabilities
      Table 3.5 Key Domestic Semiconductor Discrete Packaging Companies
3.5 Key Domestic LED Companies & Packaging Capability
      Figure 3.5 History of LED Industry Revenue in China
      Table 3.6 Key Domestic LED Packaging Companies

4.   CHINA PACKAGINIG AND ASSEMBLY MATERIALS & EQUIPMENT OUTLOOK
4.1 China Packaging Materials Market Overview
      Figure 4.1 Packaging Materials Market Size by Region
      Figure 4.2 Key Packaging Materials Suppliers in China
      Figure 4.3 China Packaging Materials Market by Segment
4.1.1 Leadframe Market in China
      Figure 4.4 Leadframe Market Trends
      Table 4.1 Leadframe Foreign Manufacturing Facilities in China
      Table 4.2 China-headquartered Leadframe Suppliers
4.1.2 Substrate Market in China
      Table 4.3 Standard Characteristics and Suppliers' Technology Capability for Flip-Chip Substrates
      Table 4.4 Comparison of Key Suppliers' Technology Capabilities for Flip-Chip Substrates 
      Figure 4.5 Substrate Market Trends
      Table 4.5 Key Domestic Substrate Suppliers and their Status in 2016
4.1.3 Mold Compound Market in China
      Figure 4.6 Mold Compound Market Trends
      Table 4.6: Key Mold Compound Suppliers in China
4.1.4 Bonding Wire Market in China
      Figure 4.7 Bonding Wire Market Trends
      Figure 4.8 Bonding Wire Market Trends in China by Volume 
      Table 4.7 2016 Ranking of Wire Suppliers in China
4.1.5 Trends and Opportunities for Domestic Packaging Materials Suppliers
4.2 China Packaging and Assembly Equipment Market Outlook
      Table 4.8 Comparison of China's Assembly and Packaging Equipment Market to the Worldwide Equipment Market
      Figure 4.9 China Assembly Equipment Market vs. China Manufactured Equipment
      Table 4.9 2016 Ranking of Assembly and Packaging Equipment Suppliers in China

5. SUMMARY AND CONCLUSIONS

6. APPENDICES
        Appendix A: List of Acronyms and Abbreviations
        Appendix B: List of Figures and Tables
        Appendix C: Excel Workbook
        The Excel Workbook contains some of the raw data presented in this report;subscribers may use the raw data for further data mining and modeling.The data file is shipped in a separate file with Microsoft Excel document format.

 

 

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文章收入时间: 2018-02-24
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