设为首页 设为首页 加入收藏 加入收藏 网站地图
[请登陆][免费注册]
搜 索

半导体产业报告
中国半导体封装市场研究报告(2014/2015版)
                   0
出自:SEMI中国

详情咨询请联系SEMI中国
张优红(86.21.60278579, czhang@semi.org

《中国半导体封装市场报告2014/2015》简介

随着《国家集成电路产业发展推进纲要》的实施和推动,2014年中国集成电路产业已经达到491亿美元的规模,其中封装产业依然以年均增长率19%的成长率贡献了接近一半的营收。截至2014年,全球封装材料市场已经达到199.3亿美元,中国封装市场以全球最高的复合增长率就占据了全球约20%的市场;另外,中国的封装设备市场也占全球封装设备市场的30.4%。

SEMI® 中国近期完成了关于针对中国半导体封装市场的深入研究报告,收集调查了超过140家中国封装厂以及分立器件公司的经营资料,并调查了主要多家封装材料和设备的供应商,以确保此份报告的准确性和前瞻性。


 
此份报告回答了以下关键问题:
• 全球经济发展的形式下中国半导体封装市场的发展状况;
• 近几年出台了的国家政策对半导体及封装行业有什么导向和影响;
• 2013-2015年中国封装厂所发生的重大并购事件和建厂状况;
• 2005-2019年全球以及中国封装材料的销售情况以及市场预估;
• 最新中国封装材料和设备供应商的发展情况。

关于本报告更多信息请联络SEMI中国半导体产业资深分析师Shanshan Du ,sdu@semi.org

主要内容

China Semiconductor Packaging Market Outlook

1.   INTRODUCTION
1.1 Methodology
      Table 1.1 Companies Interviewed 
1.2 Assumptions
      Table 1.2 Currency Exchange Rates
1.3 Report Organization

2.   BACKGROUND OF CHINA SEMICONDUCTOR PACKAGING MARKET
2.1 China Macro Economy & Electronic Product Manufacture
      Table 2.1 China Electronic Product Market
      Figure 2.1 China GDP & GDP Growth Rate (2000-2015Q3)
2.2 China Government’s Policy on Semiconductor Industry and Packaging &Testing
      Figure 2.2 Central Government Policy on Semiconductor Industry
      Table 2.2 National guideline targets for Semiconductor Industry
      Table 2.3 Major Investment of China National IC Fund
      Table 2.4 Announced Local Investment IC Fund summary
2.3 China Semiconductor Industry
      Figure 2.3 China Semiconductor Industry Revenue
      Table 2.5 China Semiconductor Industry Revenue by Segment

3.   CHINA SEMICONDUCTOR PACKAGING INDUSTRY OUTLOOK
3.1 Semiconductor Packaging and Assembly Companies in China
      Figure 3.1 Package Company Demographics by Category
      Table 3.1 World Top Ten OSAT Facilities in China
      Table 3.2 World Top Ten IDM P&T Facilities in China
      Figure 3.2 Package Company Demographics by Locations
      Figure 3.3 Map of Leading Package and Test Plants in China
      Figure 3.4 China-Based Leading Packaging House Revenue Trend
3.2 Semiconductor Packaging and Assembly Activities in China 2013~2015
3.3 Advanced Package (Bumping/WLCSP & TSV) in China
      Table 3.3 Companies with Bumping/WLCSP/TSV Lines in China
      Table 3.4 Domestic WLP Equipment Suppliers
3.4 Key Domestic Semiconductor Discrete Companies & Package Capabilities
     Table 3.5 Key Domestic Semiconductor Discrete Companies

4. CHINA PACKAGINIG AND ASSEMBLY MATERIALS & EQUIPMENT OUTLOOK
4.1 China Packing Materials Market Overview
      Figure 4.1 Packaging Materials Market Size by Region
      Figure 4.2 Key Packaging Material Suppliers in China
      Figure 4.3 China Packaging Materials Market by Segment
4.1.1 Leadframe Market in China
      Figure 4.4 Leadframe Market Trends
      Table 4.1: Leadframe Manufacturing Facilities in China
      Table 4.2: China-headquartered Leadframes Suppliers
4.1.2 Substrate Market in China
     Table 4.3: Applications and major supplier for Different Substrate Types
     Figure 4.5 Substrate Market Trends
     Table 4.4: Key domestic Substrate Suppliers and their status at 2014
4.1.3 Mold compound Market in China
     Figure 4.6 Mold compound Market Trends
     Table 4.5: Key Mold Compound Supplier in China
4.1.4 Bonding Wire Market in China
     Figure 4.7 Bonding Wire Market Trends
     Figure 4.8 Bonding Wire Market Trends in China by volume
     Table 4.6: 2014 Ranking of Wire Supplier in China
4.1.5 Trends and Opportunities for Domestic Packaging Material Suppliers
4.2 China Packaging and Assembly Equipment Market Outlook
     Table 4.7 Difference between China Assembly Equipment and Worldwide Equipment Market
     Table 4.8 China Assembly Equipment Market vs China Manufactured
     Table 4.9 2014 Ranking of Assembly Equipment Makers

5. SUMMARY AND CONCLUSIONS

6. APPENDICES
    Appendix A: List of Acronyms and Abbreviations
    Appendix B: List of Figures and Tables
    Appendix C: Excel Workbook

 

 

                   0
文章收入时间: 2016-03-21
相关信息
中国半导体产业链全析2017 2017-09-04
 
 
SEMI简介 | About SEMI | 联系我们 | Privacy Policy | semi.org
上海集成电路协会 | 中国电子报 | 赛迪网半导体 | 电子产品世界 | 中电网 | 中国电子材料网
Copyright © 2017 SEMI®. All rights reserved.
沪ICP备06022522号
沪公网安备31011502000679号