1. Develop new and improve existing Cu ECP process formulations based on process requirements and specifications, characterize process windows,
2. Define equipment maintenance schedule, document techniques and BKMs for manufacturing, and compile final information package supporting technology transfer to customers.
3. Internally this person will work with HW and SW engineers to propose, test and implement system modifications;
4. Externally this person will support customer demo’s and onsite equipment qualification and trouble-shooting.

• BS /MS degree or higher in the field of materials science, physical chemistry, physics or chemical engineering, electrical engineering.
• Strong analytical skills and teamwork mentality are required.
• Knowledge of applied electrochemistry and semiconductor process flow is a plus.
• Proficiency in written and verbal communications in English;
• Computer skills (MS office applications including data management required,
• Experiences with statistical analysis/DOE SW such as JMP or Minitab preferred;
• Quick-learner, teamwork and responsible personal characteristic;
• Willing to travel;

1. Develop new and improve existing CuECP process formulations based on gapfill, defectivity, reliability, and other physical and electrical requirements;
2. Define plating process windows and develop BKMs for manufacturing;
3. Characterize properties/structures of Cu interconnects with electron microscopy and other techniques;
4. Characterize plating bath lifetime, bleed/feed rate, and does frequency with electrochemical methods, such as CVS.
5. Optimize wafer sequence through robot/process modules to gain output.
6. Work with chemistry vendors on selecting and qualifying plating chemistry.

1. BS/MS degree or higher in the field of physical chemistry or materials science with experience in applied electrochemistry:
2. Strong analytical skills and teamwork mentality are required:
3. Proficiency in written and verbal communications in English;
4. Good materials characterization skills;
5. Computer skills (MS office applications including data management required, experience with statistical analysis/DOE SW such as JMP or Minitab preferred);

1. Work with ECP team to develop new and improve existing Cu ECP process formulations based process specifications.
2. Develop measurement BKMs for specific bath chemistries.
3. Characterize measurement capability and improve accuracy and repeatability for a selected metrology.
4. Work with HW and SW engineers on inline bath metrology integration;
5. Involved with chemistry and metrology vendors on selecting and a metrology technique for system integration;

1. BS/MS degree or higher in the field of physical chemistry or materials science with experience in applied electrochemistry:
2. Strong analytical skills and teamwork mentality are required.
3. Proficiency in written and verbal communications in English;
4. Good computer skills (MS office applications including data management required, experience with statistical analysis/DOE SW such as JMP or Minitab preferred);

1. Have the goal and drive to pioneer and expand the development of Cu SFP technology (Stress Free Polishing) as a mainstream product in interconnect manufacture;
2. Improve electrolyte to improve surface quality and reduce the defectivity;
3. Define equipment maintenance schedule, document techniques and BKMs for manufacturing, and compile final information package supporting technology transfer to customers.
4. Internally this person will work with HW and SW engineers to propose, test and implement system modifications;
5. Externally this person will support customer demo’s and onsite equipment qualification and trouble-shooting.

1. BS /MS degree or higher in the field of materials science, physical chemistry, physics or chemical engineering, electrical engineering.
2. Strong analytical skills and teamwork mentality are required.
3. Knowledge of applied electrochemistry and semiconductor process flow is a plus.
4. Proficiency in written and verbal communications in English;
5. Computer skills (MS office applications including data management required,
6. Experiences with statistical analysis/DOE SW such as JMP or Minitab preferred;
7. Quick-learner, teamwork and responsible personal characteristic;
8. Willing to travel;

1. Develop new and improve existing wafer cleaning process formulations based on process requirements and specifications, characterize process windows;
2. Character back side surface contamination level through XRF;
3. Define equipment maintenance schedule, document techniques and BKMs for manufacturing, and compile final information package supporting technology transfer to customers.
4. Internally this person will work with HW and SW engineers to propose, test and implement system modifications;
5. Externally this person will support customer demo’s and onsite equipment qualification and trouble-shooting

1. BS /MS degree or higher in the field of materials science, physical chemistry, physics or chemical engineering, electrical engineering.
2. Strong analytical skills and teamwork mentality are required.
3. Knowledge of applied electrochemistry and semiconductor process flow is a plus.
4. Proficiency in written and verbal communications in English;
5. Computer skills (MS office applications including data management required,
6. Experiences with statistical analysis/DOE SW such as JMP or Minitab preferred;
7. Quick-learner, teamwork and responsible personal characteristic;
8. Willing to travel;

1. Develop installation, service and technique support manual for the company’s mainstream products
2. Perform equipment maintenance schedule, document service techniques and procedure for manufacturing, and compile final information package supporting technology transfer to customers.
3. Internally this person will work with HW and SW engineers, and process engineers to maintain the in house tools and assist to test and implement system modifications;
4. Externally this person will support customer onsite equipment hardware installation, qualification and trouble-shooting, document the failure mode, failure rate, and service PM

1. Based on specification, perform concept design, feasibility study of semiconductor equipment build prototype;
2. Based on feedback from Process Engineer to modify the mechanical system to meet process capability, service capability and reliability;
3. Work with Electrical Engineer and Software Engineer to perfect the mechanical system;
4. Perform mechanical functional and reliability test, and troubleshoot the weak point;
5. To design mechanical system not only meet functional requirement but also meet requirement of low manufacture cost, easy service, and reliable;
6. Build necessary theoretical model to verify and predict mechanical system covering mechanical strength, deformation, temperature distribution, vibration and components life time;

1. BS degree (MS is a plus) majoring in Mechanical Engineering
2. Knowledge of mechanics, material mechanics, and thermal mechanics.
3. Knowledge of electrical circuit, automatic control theory, and control software
4. At least five years working experience in engineering instrument design and development.
5. Semiconductor equipment and tool design and development is a plus
6. Hands on experience to design and build prototype of instrument
7. Experience in motion control and necessary knowledge of interface between mechanical system and control system.
8. Working knowledge of Solid Works 3D, and/or AutoCAD 3D is must.
9. Working knowledge of Pro/E is a big plus.

1. To design semiconductor equipment system includes moving parts and liquid delivery;
2. Can perform independent design works based on design specification;
3. Work with process engineer to design or modify the mechanical system;
4. Perform mechanical stress, strength, and deformation calculation.
5. Perform temperature distribution, thermal stress, and thermal expansion calculation

1. BS/MS degree majoring in Mechanical Engineering
2. Knowledge of mechanics, material mechanics, and thermal mechanics
3. Knowledge of electrical circuit, automatic control theory, and control software
4. Working knowledge of Solid Works 3D, and/or AutoCAD 3D is must.
5. At least two years working experience in engineering instrument design and development, fresh student is also welcome
6. Experience in motion control and necessary knowledge of interface between mechanical system and control system.
7. Semiconductor equipment and tool design and development is a plus;

1. BS degree (MS is a plus) majoring in Electrical Engineering or Computer Science.
2. Solid digital logic, digital IO, and analog IO knowledge are required.
3. Knowledge of hardware language VHDL or VERILOG or ABEL is a big plus.
4. Knowledge of software language C/C++ is a plus
5. Five years (for senior) working experience in electrical or computer science related job.
6. Hands on experience such as troubleshooting in complex computer controlled systems, with a large number of DIO and AIO channels, is required.
7. Experience in digital circuit design is required.
8. Documentary work in English is required;
9. MICROSOFT Office Tool such as Word, Excel is required.
10. AutoCAD is a big plus.
11. Electrical schematic captures such as ORCAD or PROTEL or ACCEL is required.
12. The working knowledge of hardware language VHDL or VERILOG or ABEL and their design tools such as ISE from XILINX for FPGA (Field Programmable Gate Array) and CCSTUDIO from TI for DSP (Digital Signal Processor) are a big plus.
13. Able to read documents in English are big plus.
14. The engineer level is determined on individual detail profile
15. Applied to both Engineers and Technicians
16. Semiconductor equipment control system development is a plus

1. Implement software architectural elements as defined by the senior software engineer
2. Software design
3. Coding
4. Testing
5. Development of software tools
6. Bug fixing and customer support
7. Perform other software duties as necessary
8. Participate in design and code review

1. MS Degree major in Electronic Design/ Software/ Electricity is a must;
2. One to three years experience in software development including software design experience
3. Minimum of BSCS or equivalent
4. Able to communicate using English both verbally and in writings
5. C/C++
6. Visual C++ with MFC on Windows platforms (NT/XP)
7. VB
8. HMI (Human Machine Interface) development
9. Semiconductor equipment software development is a plus

1. Perform software architectural design for new products
2. Directly dealing with customers in pursuit of new product design and provide technical support
3. Design of software to interface with/control servo drives, fluid, power, digital and analog IO, and temperature
4. Coding
5. Testing
6. Conduct design and code review

1. MS Degree major in Electronic Design/ Software/ Electricity is a must;
2. Minimum five years experience in software development for industrial products including motion control systems
3. Minimum of BSCS/MSCS or equivalent
4. Able to communicate using English both verbally and in writings
5. C/C++
6. Visual C++ with MFC on Windows platforms (NT/XP)
7. VB
8. SQL
9. Real-time control system
10. Semiconductor equipment control software development is a plus

联系方式： 上海市松江出口加工区B区东开置业园A1栋 201416
Mail: dianawang@acmrc.com