Time: November 4-5, 2010
Venue: China National Convention Center (CNCC), Beijing, China
Organizer: Beijing Municipal Commission of Economy and Information Technology
Co-organizers: Beijing Semiconductor Industry Association (BSIA)
Co-sponsors: China Semiconductor Industry Association (CSIA)
China silicon giant foundry SMIC is now expanding its first 300mm fab capacity in Beijing from 20,000 wpm to 45000. With government supporting plan, it appears to be getting ready to announce further expansion plans to build new 300mm fab with more capital investment. Beijing will be an advanced IC manufacturing center in China.
As the leading project of China Digital TV Industry Park in Beijing, BOE’s 8.5G TFT-LCD manufacturing equipment orders were already shipped out. Volume production will be in Q3 next year. BOE will be the world No. 5 TFT-LCD panel makers in 2012.
BIMS 2010 conference and exhibition will be the best platform to meet your customers in SMIC, BOE, research institutes and academy in Beijing. BIMS has 10 years history and is supported by Beijing government, Ministry of Science and Technology (MOST), Ministry of Information and Industry Technology (MIIT). The conference attendee number is more than 600 in 2009.
Topics of 2010 conference will mainly focus on advanced semiconductor equipment, materials and process, TFT-LCD manufacturing equipment, material and process, packaging and test. More than 600 professional attendees from SMIC, BOE, Institute of Semiconductors, Institute of Microelectronics, Peking University, Tsinghua University, IC design companies, equipment and material companies and etc will be the target audiences. BIMS 2010 will be the best platform to communicate with the industry in Beijing.